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自華光電® 焊針|瓷嘴|鋼嘴|劈刀 myBlossom® Semiconductor Bonding Capillary


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自華® 焊針|瓷嘴|鋼嘴|劈刀
myBlossom® Semiconductor Bonding Capillary

設計製造各種精密工具的專業廠商,世界半導體封裝精密工具製造的領航者。最先進的設備及生產技術,達到最小公差規格,維持高質量的產品,精密度業界第一。工程團隊協助客戶解決金線、銅線、合金線、銀線 & 鋁線相關技術問題,增強客戶國際市場競爭力。

瓷嘴 ** 資料來源: 打線接合 維基百科-自由的百科全書
依照不同形狀的瓷嘴形狀,可將接合方式分為兩種,分別為楔型接合(wedge bonding)及球型接合(ball bonding),兩者擁有截然不同的第一銲點及第二銲點,因此具有不同的空間特性。

楔型接合
楔型接合是將突出於瓷嘴的線材直接下壓至基板上,由於第一銲的限制,第二銲點的位置被限制在沿著第一銲接腳的方向上,無法如球型接合一樣自由,也因為如此,楔型接合的高度通常較球型接合來得小,外觀如拋物線一樣,銲點寬度約為1.5倍的線徑。

球型接合
球型接合則是先經過一個放電製程,稱為放電結球(Electronic flame off, EFO),利用高壓電放電,將凸出瓷嘴的線熔化,因為表面張力的關係,金屬液體會凝固成一個球狀物,此時再下壓至基板上,接著引線向上,經過一個設定好的路徑,繞至第二銲點,直接下壓將線壓斷形成第二銲點,此魚尾形狀的第二銲點類似於楔型接合的銲點,常被誤認為楔型接合。 由於第一銲點的線材與基板呈現垂直的角度,因此第二銲點可自由選擇位置,不會受到第一銲位置的限制。此製程含有放電結球的步驟,因此稱之為球型接合,其銲點較楔型接合來得大,約2.5-5.0倍的線徑。 有時候為了降低球型接合的高度,會將一二銲位置交換,將二銲點接合在晶片上,使線材高度下降,業界稱為反打。

Semiconductor Bonding Capillary: 焊針|瓷嘴|鋼嘴|劈刀|銲針
Capillary直譯是毛細管,在半導體產業指的是銲針。封裝導線穿過銲針,銲針提供精確定位並傳導超音波以完成焊線動作。在半導體封裝製程中,依據使用的材質不同,市場上常見的說法有焊針、瓷嘴、鋼嘴 、劈刀 & 銲針等不同的稱呼。

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自華光電 - SPT®中國授權代理商.小精密電子.台灣辦事處。
SPT®無錫廠製造,內地發貨到台灣客戶大陸工廠,免除進口關稅6%。
Allen K. Lin | Allen@myblossom.tw | LINE ID: Allen-007 | Wechat ID: Allen-006 | T: 0910-782775

2019年全球焊針市場規模


2019年全球焊針/瓷嘴市場規模、見解、需求 & 2024年預測
Global Bonding Capillaries Market 2019 Size, Insights, Demand and Forecast 2024

Published by: QY Research | On: Mar 2019

Global Bonding Capillaries Market: Overview

Get a complete insight into the worldwide Bonding Capillaries Industry in this Global Bonding Capillaries Market Report. Starting from Monetary Contribution, Impact on the Economy, Types of Product/service, Key players, Previous five years of history (2014-2018), Evaluate the market size in terms of sales (volume and value) and Market Forecast by Regions, Type and Application (2019-2026).

Rapidly changing lifestyles and urbanization has lead to an increase in the growth of the global Bonding Capillaries market. With different substantial advancements made related to Bonding Capillaries, the Bonding Capillaries global market is are probably going to be increasing with the help of the various frameworks. Furthermore, the expanding population over the world significantly going to move the development of the Bonding Capillaries market on a worldwide scale.

Global Bonding Capillaries Market: Key Players

These key players have single-handedly acquired the market utilizing various strategies and continue to do so in the upcoming years. According to QYMarketStudy competitive players the consumption and demand in the global Bonding Capillaries market have increased, and they believe it shows a good growth compared to the past years in the future.

The key players/manufacturers covered in this report with sales, revenue, market share for each company:

SPT Group, Small Precision Tools, Inc. (Switzerland)
K&S Bonding Tools (Singapore)
Gaiser Tool Company (U.S.)
Adamant Co., Ltd. (Japan)
H. Fillunger & Co. Pvt. Ltd. (India)