Products

自華光電®楔焊|球焊線機(手動) myBlossom® iBond5000-Dual Wire Bonder


自華光電® iBond5000多功能鍵合機 / 楔焊|球焊線機(手動) / 楔焊|球焊打線機(手動)

iBond 5000多功能鍵合機集成了4500手動鍵合機的機械設計原理與先進的圖形化使用者介面。
iBond 5000多功能鍵合機可以處理球焊,搪焊工藝。iBond 5000是一台先進的球焊/楔焊一體機,可以為工藝研發,生產製造提供有力的技術支援。
iBond 5000功能多樣,可創造出業界的最佳價值,支援混合電路,MCM多晶片模組﹑光學器件﹑微波器件﹑感測器﹑大功率產品﹑雷射器件及分立器件等多種產品應用。

myBlossom® iBond5000-DUAL WIRE BONDER
The iBond5000 Series integrates the proven 4500 manual wire bonder mechanical design with an advanced graphical user interface. The iBond5000 Series includes 3 basic models: Wedge, Ball and Dual. The iBond5000-Dual is an advanced ball/wedge bonder used for process development, production, research or added manufacturing support. The iBond5000 provides the high yield and excellent repeatability needed for every wedge bonding application including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-Boards, Leads, Sensors, High Power Devices and much more.

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自華光電®楔焊線機|球焊線機
Allen K. Lin | Allen@myblossom.tw | LINE ID: Allen-007 | Wechat ID: Allen-006 | T: 0910-782775

自華光電®楔焊線機(手動) myBlossom® iBond5000-Wedge Wire Bonder


自華光電® iBond5000楔焊鍵合機 / 楔焊線機(手動) / 楔焊打線機(手動)
iBond5000楔焊鍵合機將4500手動鍵合機的機械設計原理與先進的圖形化使用者介面進行了良好的集成優化;可以為工藝研發,生產製造提供有力的技術支援。
iBond5000楔焊鍵合機功能多樣,可創造出業界的最佳價值,支援混合電路, MCM多晶片模組﹑ 光學器件﹑微波器件﹑感測器﹑大功率產品﹑雷射器件及分立器件等多種產品應用。

myBlossom® iBond5000-WEDGE WIRE BONDER
The iBond5000 Series integrates the proven 4500 manual wire bonder mechanical design with an advanced graphical user interface. The iBond5000 Series includes 3 basic models: Wedge, Ball and Dual.
The iBond5000-Wedge is an advanced wedge bonder used for process development, production, research or added manufacturing support. The iBond5000 provides the high yield and excellent repeatability needed for every wedge bonding application including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-Boards, Leads, Sensors, High Power Devices and much more.

自華光電®球焊線機(手動) myBlossom® iBond5000-Ball Wire Bonder


自華光電® iBond5000球焊鍵合機 / 球焊線機(手動) / 球焊打線機(手動)
iBond5000 球焊鍵合機將4500手動鍵合機的機械設計原理與先進的圖形化使用者介面進行了良好的集成優化;可以為工藝研發,生產製造提供有力的技術支援。
iBond5000 球焊鍵合機功能多樣,可創造出業界的最佳價值,支援混合電路, MCM多晶片模組﹑ 光學器件﹑微波器件﹑感測器﹑大功率產品﹑雷射器件及分立器件等多種產品應用。

myBlossom® iBond5000-BALL WIRE BONDER
The iBond5000 Series integrates the 4500 manual wire bonder mechanical design with an advanced graphical user interface. The iBond5000 Series includes 3 basic models: Wedge, Ball and Dual.
The iBond5000-Ball is an advanced ball bonder used for process development production, research or added manufacturing support. The iBond5000 provides the high yield and excellent repeatability needed for every gold ball bonding application including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers and much more.

自華光電®手動楔焊線機工作臺 myBlossom® Manual Wire Bonder Workholders


自華光電®手動楔焊機工作臺
MPP 針對不同的手動機產品應用推出了一系列的工作臺, 可處理標準產品和定制產品。
產品手冊系列中的工作臺可匹配任何一台MPP手動機使用,更多的工作臺產品將陸續推出。
MPP手動機部門將開發更多先進的工作臺產品以滿足未來日益更新的產品需求。

myBlossom® MANUAL WIRE BONDER WORKHOLDERS
MPP introduces its Workholder Catalog for Manual Wire Bonder Applications.
This catalog offers our wide range of workholders for standard and customized applications, suitable for use with all types of manual bonders.
The MPP Manual Bonder Division continues to develop advanced workholders designed to fit your specific application challenges and needs.