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Links:http://www.planoptik.com/cnt/contact/contact.html


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玻璃晶圓/石英晶圓/矽晶圓  切割 研磨 拋光

Plan Optik 供應的封裝晶圓可要求表面拋光亮面或是磨光霧面的表面。表面品質可按所需的應用來選擇(陽極鍵合,直接鍵合,濕蝕刻,需要疏水性或親水性的表面等)。Plan Optik 特別開發的 MDF(Micro Defect Free 零瑕疵表面)特殊拋光製程讓 Plan Optik 可以供應低表面粗糙度表面需求到埃(Angström)等級。

MDF 拋光
粗糙度 Ra < 0.5 nm
材料 可使用一般常用的所有材料
應用 用於直接鍵合(熔融鍵合)與濕法蝕刻

標準拋光(亮面)
粗糙度 Ra < 1.5 nm
材料 可使用一般常用的所有材料
應用 用於陽極鍵合與共晶鍵合; 光學上蓋晶圓

磨光表面(霧面)
粗糙度 Ra 最小 0.1 µm
材料 可使用一般常用的所有材料
應用 使用於粘著製程

在晶圓表面有不同的表面品質混合是可行的,可按客戶的需要來預先設定生產參數。

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自華光電 - 德國Plan Optik AG 玻璃晶圓/石英晶圓/載體晶圓 台灣獨家代理商。

Allen K. Lin | Allen@myblossom.tw | LINE ID: Allen-007 | Wechat ID: Allen-006 | T: 0910-782775



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Plan Optik supplies packaging wafers with either ground or polished surfaces as required. The surface texture can be selected according to the intended application (anodic bonding, direct bonding, wet etching, the need for hydrophobic or hydrophilic surfaces etc.). Special polishing techniques like Plan Optik's specially developed MDF (Micro Damage Free) process means that Plan Optik wafers can be supplied with especially low surface roughness within the Angström range if required.

MDF polishing
Roughness Ra < 0.5 nm
Material available for all materials in general use
Application for direct bonding (fusion bond) and wet etching

Standard polishing
Roughness Ra < 1.5 nm
Material available for all materials in general use
Application for anodic and eutectic bonding; optical cap wafers

Ground surfaces
Roughness Ra from 0.1 µm
Material available for all materials in general use
Application for adhesive processes

The combination of the surfaces described within a wafer is possible, as is the production of surfaces in accordance with customer-specific predetermined parameters.