Links：http://www.planoptik.com/cnt/products/micro_lenses.html
微型透鏡晶圓 Micro Lenses Wafers
Plan Optik 藉由專利的玻璃態轉化回流技術生產晶圓級的微透鏡，可生產凹凸透鏡，球面與圓柱形的玻璃透鏡結構。 Plan Optik 可提供整片的晶圓級微型透鏡來封裝微光機電系統（MOMES - Micro-opto-electromechanical systems），這些晶圓級微型透鏡另外可採用高精密的切割製程來生產單獨的透鏡或一組透鏡陣列。
材料是使用硼矽酸玻璃，具有膨脹係數與矽相近的特性。這讓加工後的透鏡可以透過陽極鍵合的方式與微結構加工的矽晶圓組合在一起，例如用在影像傳感器的光學透鏡模組上。與同一應用領域中常被使用的傳統聚合物透鏡相比，玻璃透鏡對高溫與濕度具有相當高的信賴性。由於這個因素，Plan Optik 的晶圓級透鏡可使用於半導體業的生產流程，如接觸到迴焊焊接，而不破壞其透鏡的品質。
自華光電 - 德國Plan Optik AG 玻璃晶圓/石英晶圓/載體晶圓 台灣獨家代理商。
Allen K. Lin | Allen@myblossom.tw | LINE ID: Allen-007 | Wechat ID: Allen-006 | T: 0910-782775
Allen K. Lin | Allen@myblossom.tw | LINE ID: Allen-007 | Wechat ID: Allen-006 | T: 0910-782775
MICRO LENSES
Plan Optik manufactures micro lenses on the basis of wafers by means of a patented glass reflow process which makes it possible to produce convex and concave, spherical and cylindrical glass lens structures. Plan Optik supplies these micro lenses as complete wafers for encapsulating MOEMS (Micro-opto-electromechanical systems); alternatively, by employing a high-precision cutting process, they can also be produced singly as individual lenses or arrays.
The material used is borosilicate glass whose expansion coefficient has been adapted to that of silicon. This permits the processing of lens wafers using anodic bonding with micro structured silicon wafers, for example for the construction of image sensors. In contrast to the polymer lenses traditionally used in this field, glass lenses demonstrate a considerably higher resistance to high temperatures and humidity. For this reason the use of Plan Optik lens wafers permits the carrying out of manufacturing processes frequently employed in the semiconductor industry, such as the soldering of contacts, without destroying the lenses.
Plan Optik manufactures micro lenses on the basis of wafers by means of a patented glass reflow process which makes it possible to produce convex and concave, spherical and cylindrical glass lens structures. Plan Optik supplies these micro lenses as complete wafers for encapsulating MOEMS (Micro-opto-electromechanical systems); alternatively, by employing a high-precision cutting process, they can also be produced singly as individual lenses or arrays.
The material used is borosilicate glass whose expansion coefficient has been adapted to that of silicon. This permits the processing of lens wafers using anodic bonding with micro structured silicon wafers, for example for the construction of image sensors. In contrast to the polymer lenses traditionally used in this field, glass lenses demonstrate a considerably higher resistance to high temperatures and humidity. For this reason the use of Plan Optik lens wafers permits the carrying out of manufacturing processes frequently employed in the semiconductor industry, such as the soldering of contacts, without destroying the lenses.
