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Links:http://www.planoptik.com/cnt/contact/contact.html




玻璃晶圓/石英晶圓/矽晶圓 陽極鍵合 直接鍵合 共晶鍵合

Plan Optik 的封裝晶圓是由組合不同材料來製造,特別按照所需的應用使用適合的鍵合流程。

陽極鍵合
硼矽酸玻璃與矽鍵合。永久性,耐高溫,密封鍵合,不需使用輔助材料。

直接鍵合
將不同種類的玻璃鍵合或是與矽鍵合。永久性,耐高溫,密封鍵合,不需使用輔助材料。

粘合製程
可按不同應用所使用的材質來鍵合所有晶圓材料以及具有永久性與可逆性的粘接。

共晶鍵合
採用金屬合金材料來鍵合所有晶圓材質,例如鈦金。



自華光電 - 德國Plan Optik AG 玻璃晶圓/石英晶圓/載體晶圓 台灣獨家代理商。

Allen K. Lin | Allen@myblossom.tw | LINE ID: Allen-007 | Wechat ID: Allen-006 | T: 0910-782775



BONDING TECHNOLOGIES

Packaging wafers by Plan Optik which are manufactured from material combinations are produced specially according to the proposed application using suitable bonding processes.

Anodic bonding
For bonding borosilicate glass with silicon. Permanent, temperature-resistant and hermetic bonding without the use of auxiliary materials.

Direct bonding
For bonding different types of glass with each other and with silicon. Permanent, temperature-resistant and hermetic bonding without the use of auxiliary materials.

Adhesive processes
For bonding wafers of all materials using application-specific optimized media for permanent as well as reversible bonding.

Eutectic bonding
For bonding wafers of all materials using metallic alloys such as, for example, titanium-gold.

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