Links:http://www.planoptik.com/cnt/products/packaging_wafers.html
封裝晶圓 Packaging wafers
Plan Optik 所生產的封裝晶圓包含從客製化的單一項目到業界大量使用的玻璃,石英,與矽,或是組合這三種材料的複合晶圓。晶圓直徑從 50 mm 到 300 mm,具有低厚度公差與低 TTV 值。在每個應用上根據客戶特定的要求加工晶圓表面的結構,例如光學腔體,鍍膜,與鑽孔。
Plan Optik 生產的封裝晶圓用來封裝並應用在高氣密性要求的光學或是化學偵測器,壓力傳感器,與加速度傳感器。典型的產業應用在消費性電子產品(CMOS 影像,微反射鏡),汽車工業(壓力傳感器,如輪胎,發動機監控),航空(三維加速度傳感器),化學(微反應技術),醫藥(實驗室晶片)以及一般的半導體製造。
自華光電 - 德國Plan Optik AG 玻璃晶圓/石英晶圓/載體晶圓 台灣獨家代理商。
Allen K. Lin | Allen@myblossom.tw | LINE ID: Allen-007 | Wechat ID: Allen-006 | T: 0910-782775
Packaging wafers
Plan Optik manufactures packaging wafers from custom-made single items to large-scale series using glass, quartz and silicon and combinations of these three materials. The diameter is 50 - 300 mm with low thickness tolerances and low ttv values. In each case the structuring of the wafer is carried out on a customer-specific basis, for example with optical cavities, coatings and drillings.
Packaging wafers by Plan Optik are used to pack and thus to seal hermetically optical or chemical sensors, pressure sensors and acceleration sensors. Typical industrial applications lie in the fields of consumer electronics (CMOS imaging, micro-mirrors), automotive technology (pressure sensors, e.g. tires, engine monitoring), aerospace (3D acceleration sensors), chemistry (micro-reaction technology), pharmaceuticals (lab-on-chip) and in the general manufacture of semiconductors.
** Glass Wafer materials
Schott: D263T eco , AF32 eco , MEMpax , BOROFLOAT 33 , B270 , FOTURAN II , AS87 eco , 0787 , BF33 , D263
Corning: SG3.4 , SG7.8 , SG9.0 , SG-HS , SG-HC , Eagle XG , EXG , EagleXG
NEG: ABC-G , A58 , A66S , A69 , A75 , A91S
AGC: EN-A1