Products

Micro Point Pro Ltd. (MPP)


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MPP有限公司,前身為K&S Micro-Swiss劈刀&黏芯工具製造部,公司成立於2010年。MPP無論在前道和後道工序上均已確立了其自身在全球半導體市場領域的領者者地位,MPP為所有主要的包裝工藝提供綜合性的解決方案,以適應不斷增長的,高精度狀態下的可擴展工具的定制需求,以便用於具有全部封裝工藝的微電子工業內,MPP也是世界領先探頭製造商,用於測量晶片電阻率或導電薄膜。MPP進一步鞏固了其快速增長的精細加工廠在製造業界的聲譽,可提供多樣化組合式高精度工具。

MPP擁有先進和獨特的製造設備及專業的塗料技術,已使所有者能夠提供最佳成本效益方式提供高品質解決方案,使客戶能夠快速克服行業新訴求所面臨的各種挑戰,MPP以其高度靈活的工程與製造環境為榮,在不影響品質的前提下,使產品快速投放市場,交貨期短。近年來,我們在不斷宣傳對各種不同技術市場的自身價值論,例如:醫療與航空航太工業,我們擁有專業的工程師和設計師和精幹,靈活,高效的服務機構,我們將自身準確地定位高精度微細加工應用領域,這樣可廣泛地加工各種不同的先進金屬材料,塑膠和陶瓷材料。我們已準備就緒,為您的下一個挑戰提供給有利的支援。

Micro Point Pro Ltd (MPP) was founded in 2010. Since then, MPP has established itself as a global leader in the semiconductor marketplace, in both the back and front end.  MPP offers comprehensive solutions to meet our customer's growing demands for high-precision expendable tools for the micro-electronics industry for all major packaging processes as well as Probe Heads solutions for wafers or thin conductive films resistivity tests.  MPP is also a world leader the manual wire bonders industry with our state-of-the-art products and support.

MPP has further established itself as a leading supplier of standard and customized high-precision tools and parts for the Medical, Aerospace and Military Industries. With sophisticated and unique manufacturing equipment, along with patented coating technologies, MPP provides high-quality solutions with the best cost of ownership, allowing customers to rapidly meet the demanding needs of their industry. MPP takes pride in its flexible engineering and manufacturing environment, which facilitate responsiveness and short time to market without compromising quality.  Our professional engineers are available to discuss optimization of design and process of parts with complex geometry and tight tolerances, manufactured from a variety of advanced metals, plastics and ceramics.

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自華光電 - 以色列MPP Tools 台灣代理商。
Allen K. Lin | Allen@myblossom.tw | LINE ID: Allen-007 | Wechat ID: Allen-006 | T: 0910-782775

鋁線鍵合劈刀 Wedge Bonding Tools


鋁線鍵合劈刀
傳統劈刀鍵合工藝,作為優先選擇的工藝而被廣泛應用到鋁線鍵合的各種領域。如今,它正逐漸成為內部接合中可選擇的工藝方式,例如:卷帶自動鍵合、倒裝晶片及其它應用領域。劈刀鍵合技術仍然是鋁絲鍵合工藝應用領域中的一種選擇。

MPP採用各種不同的硬質合金材料開發&製造出各類不同型號的劈刀鍵合工具,其中,由碳化鎢材料製成的工具成為鋁絲應用領域的首選材料,然而,鈦合金工具則適用于金線劈刀鍵合工藝。

WEDGE BONDING TOOLS
Traditionally Wedge Bonding was used as the preferred process for wire bonding applications that use aluminum wire. Today, it is becoming the process of choice for interconnect methods such TAB, FLIP Chip and others.Wedge Bonding remains the choice for Wire Bonding process and applications that use aluminum wire.

MPP develops and manufactures a broad range of Wedge Bonding tools from a variety of carbide materials. The most popular tungsten carbide tools are used for aluminum wire applications while titanium carbide tools are suitable for gold wire Wedge Bonding.

晶片鍵合劈刀 Die Bonding Tools


晶片鍵合劈刀
晶片鍵合過程發生在鋁線鍵合之前。將選定的晶片進行封裝,封裝時採用共晶或粘芯固晶方法進行機械連接。晶片夾腳應用在晶片需要高精密定位的過程中:在晶片和粘合工具之間保持最小接觸面,使其具有很強的握力--特別是在共晶晶片鍵合過程中得到應用。


扁平吸嘴用於熱壓或銀漿固晶過程中的拾起、轉移、放置晶片到焊盤的工具。MPP可提供各種不同材料製成的真空吸嘴。它們可用於各種不同領域。採用特別定制且擁有獨一無二裝配過程。 它們可適用於全部普通晶片鍵合機器型號。

DIE BONDING TOOLS
The Die Bonding process takes place prior to wire bonding. The selected die is placed in a package and mechanically connected using either eutectic or adhesive die attach methods.Die collets are used when the process requires high accuracy for the positioning of the die. They allow for minimal contact between the die and the attachment tool and provide a strong grip, especially in the eutectic die bonding.

The Flat Face Pick Up tool is used in a Thermo-compression or Epoxy Die Attach process for picking up, holding, transferring and placing a die on the substrate.Micro Point Pro offers a wide selection of Vacuum Pick Up tools for various applications,  manufactured from a wide range of materials and custom designed for your unique assembly process. Our tools are suitable for use with all common die bonding machine models.

液體點膠頭 Fluid Dispensing Tools


液體點膠頭
MPP設計並生產固晶工藝中所使用的各類點膠頭和壓焊工具,這些工具都可以根據客戶的應用要求進行量身定做,並由金屬,陶瓷等各類基材可供選擇,MPP銀漿點膠噴嘴設計可防止出現不連續的銀漿,例如:拖尾、橋接、空隙及銀漿覆蓋不足等現象。

常用點膠頭類型如下:燒錄噴筆、噴頭/多頂針噴嘴、V型溝槽/U型溝槽噴嘴。點膠頭設計用於歐洲半導體設備公司、動態穩定系統或任何其它黏芯機器。在許多情況下,使用特製的,可調整的適配器是必不可少的,MPP已開發出一種特殊的製造過程,該過程可確保適配器具有較高精確度,因而,它可防止漏液,順利完成點膠過程。

FLUID DISPENSING TOOLS
Micro-Point Pro excels in the design and manufacture of various types of dispensing nozzles for customized applications. Our dispensing nozzles are designed for accurate dispensing of the glue onto the substrate which helps to prevent inconsistent epoxy problems like tailing, bridging, voids and insufficient epoxy coverage. This enables our customers to achieve superior dispensing performance. The complete set of nozzles and adaptors is available for all types of bonders in the market.

The common tool designs are: Writer Nozzle Pen、Shower Head / Multi-Needle Nozzle、V-Groove / U-Groove Nozzle Shape. The dispensing tools can be designed for ESEC, ASM or any other Die-Attach machine. In many cases, it is essential to use customized and adjustable adaptors. MPP has developed a manufacturing process that ensures that its adaptors are accurate, thus  preventing leakage and allowing for a smooth dispensing process.

晶圓和薄膜電阻率測量探頭 Four Points Probe


晶圓和薄膜電阻率測量探頭
MPP是四點探頭的領先供應商,可用於晶圓電阻率以及導電薄膜的加工製造。我們的探頭在全球已使用多年,可用于最負盛名的晶圓電阻率測量設備上。我們可製造一整套複雜探頭元件(主體,佈線和針),可用于定制的高精密設備上。經過多年經驗的積累,我們的專業技術人員可裝配出高精度的優質探頭,用於滿足市場上的短期交付使用要求。

頂針之間的間隙範圍可達到:0.635mm--1.591 mm(緊密度容限:+/-0.005mm)。頂針壓力範圍在:50g --200g(緊密度容限:+/-1g)。根據需求,我們只提供頂針,我們的頂針在市場上屬於優質頂針,它的超細拋光頂針的頂部半徑可從0.025mm -- 0.635mm。針尖半徑尺寸範圍:0.025mm--0.635mm。

FOUR POINTS PROBE
MPP is a leading supplier of Four Point Probe heads for measurement of resistivity on wafers and on thin conductive films. Our probe heads have been used for many years all over the world on the most well-known wafer resistivity measuring equipment. We manufacture complete and complex probe head assemblies (body, wiring and needles) on high precision customized equipment. With years of experience, our expert technicians assemble high accuracy best-in-class quality probe heads. Flexible production schedules allow for short lead time.

Spacing between needles is available from 0.635mm to 1.591 mm (with tight tolerance: +/-0.005mm). Needle pressure is available from 50g to 200g (with a tight tolerance of +/-1g). Upon request, we supply needles only. Our needles known for their excellent quality and very fine polishing. Needle tip radius varies from 0.025mm to 0.635mm.

特製的微電子工具 Customized Tools


特製的微電子工具
MPP在半導體及微電子裝配業所使用的定制工具和鋁線鍵合領域擁有淵博的技術製造經驗。MPP擁有深厚的專門技能,可設計並製造表面貼裝技術工具,實施球焊工藝和其它各種輔助部件,例如:指形壓板,它用於粗線鍵合工藝、夾緊部件、加工部件和液體點膠頭適配器;

MPP 與半導體行業的領先企業通力合作,MPP可為領先的原始設備製造商,提供精密工具和其他部件,領先原始設備製造商,可將它們用於批量生產以及生產同一時期的新一代各種機器的原始工具。

CUSTOMIZED TOOLS
MPP has extensive in-depth experience in wire bonding and in custom tools for the semiconductor and microelectronic assembly industries. MPP has the know-how and capability to design and manufacture Surface Mount Technology tools, ball soldering and other accessories such as finger clamps for Heavy wire bonding process, clamping and p-parts, and special adaptors for liquid dispensers.

MPP collaborates with leading companies in the semiconductor industry and provides precision tools and customized parts to leading OEMs for mass production as well as prototyping tools for the next generation machines.

表面貼裝技術 SMT Tools


表面貼裝技術
MPP可提供各類傳統工藝條件下的表面貼裝技術工具和/或特製工藝條件下的表面貼裝技術工具,每一種具體需求均可獲得最佳工藝性能。MPP獨一無二的材料組合,有助於提高生產率,它的精確設計能夠:減少真空檢測誤差、減少部件損失率、良好的光學識別體系可用於無反射陶瓷,甚至可應用到金屬零件上。

MPP將其自身定位為表面貼裝技術的領航者,因為MPP:
在品質方面-可提供具有較高幾何準確度和重複率的產品,以滿足嚴格制定的半導體行業標準。在設計靈活性方面-具有按客戶要求設計製造幾何形狀的技術能力,可滿足多樣化的應用領域的挑戰。在材料方面—MPP獨一無二的陶瓷刀片與各類材料組合在一起,應用廣泛。(如:塑膠、金屬),可改善工具性能,增加生產率。在 "性價比"方面提供最佳選擇—創新型的陶瓷噴嘴可增強產品壽命,讓產品價格具有競爭力。

SURFACE MOUNT TECHNOLOGY
MPP offers surface mount technology tools for conventional process and/or for customized process per specific applications. MPP delivers improved productivity due to a unique material combination and an accurate design enabling: Less vacuum detection errors、Reduced component drops、Better optical recognition with non-reflective ceramic and even with metal parts.

MPP is positioned as the market leader for SMT tools due to:
Quality - high geometrical accuracy and repeatability which meet the strict standards of the semiconductor industry. Design flexibility and capabilities to meet diverse application challenges. Material – MPP's unique ceramic tip can be combined with a wide range of materials (i.e. plastic, metal) that improve tool performance and increase productivity. Best "value to price" ratio - innovative ceramic nozzle allows longer life span at a competitive price.

球焊 Ball Soldering


球焊
在此硬磁碟機(HDD)的裝配過程中可使用到各種類型的工具和材料:毛細管、劈刀、卷帶自動接合工具和點膠頭。目前,焊料射流鍵合工藝是一種標準技術,可支援硬碟驅動器。除了普通的硬碟驅動器應用領域以外,硬碟驅動器工藝還普遍應用于其他應用領域,例如:硬碟驅動器裝配(磁阻磁頭, HAS, 連接裝置)。球柵陣列封裝/塑膠無引線晶片載體的球焊技術。攝像機模組。晶圓滾筒打磨和晶片尺寸封裝過程中的錘擊工藝。


它具有領先的技術設計,經證明,它具備解決大尺寸、高精度、內表面粗糙、精確的內部幾何圖形的技術能力以及可提供具有競爭力的價格,這些都均使MPP在焊料射流工具製造方面成為技術領先的供應商。

BALL SOLDERING
The Hard Disk Drive (HDD) assembly process uses a variety of tool types and materials: Capillaries, Wedges, TAB Tools and Dispensers.  Solder Jet Bonding (SJB) is now the standard technology to support HDD requirements. Beside the common HDD applications, the Solder Jet process is also common for the following applications: Hard Disk Drive Assembly (HGA, HAS, Hook-Up)、BGA / cLCC Balling、Camera Modules (VCM)、Wafer Bumbling and CSP Bumping.

Technological edge design and proven capability to handle high dimensional accuracy, inner surface roughness and accurate inner geometry, along with competitive pricing, make MPP the leading supplier for SJB tools.

配件 Accessories


配件
MPP已研製出最先進的製造技術,可滿足多種行業應用領域的客戶需求,具體地說,MPP的工程部已經開發出半導體行業中所使用的特製配件:它採用前沿工藝、封裝裝配和表面貼裝技術工藝。


採用各種高端材料,例如:碳化鎢、經過熱處理的不銹鋼、碳化矽、碳化鈦、陶瓷、特種塑膠等等,MPP使用這些材料可對於小規模與大規模生產中所使用的不同類型的配件設計提供支援。

ACCESSORIES
MPP has developed state-of-the-art manufacturing technologies which assist us in meeting  customized requests in multiple industries. More specifically, MPP’s engineering department  developed tailor-made accessories for the semiconductor industry including front end process, packaging assembly and SMT process.

The variety of high end materials such as Tungsten Carbide, Tempered Stainless Steel, Silicone Carbide, Titanium Carbide, Ceramics and Plastics, allows MPP to support these industries with a variety of accessories designed for small and large scale production.